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Research Papers

J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031001. doi: https://doi.org/10.1115/1.4064168
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031002. doi: https://doi.org/10.1115/1.4064169
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031003. doi: https://doi.org/10.1115/1.4064232
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031004. doi: https://doi.org/10.1115/1.4064338
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031005. doi: https://doi.org/10.1115/1.4064423
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031006. doi: https://doi.org/10.1115/1.4064424
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031007. doi: https://doi.org/10.1115/1.4064426
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031008. doi: https://doi.org/10.1115/1.4064428
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031009. doi: https://doi.org/10.1115/1.4064430
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031010. doi: https://doi.org/10.1115/1.4064429
J. Thermal Sci. Eng. Appl. March 2024, 16(3): 031011. doi: https://doi.org/10.1115/1.4064432

Technical Brief

J. Thermal Sci. Eng. Appl. March 2024, 16(3): 034501. doi: https://doi.org/10.1115/1.4064417
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