...@hotmail.com Email: p20190437@pilani.bits-pilani.ac.in Electronic Cooling Melting and Solidification Natural and Mixed Convection Thermal Systems Accepted Manuscript Not Copyedited Journal of Thermal Science and Engineering Applications. Received April 17, 2024; Accepted manuscript posted...

..., the temperature increase is smaller but remains uniform, indicating that the hot spots can be mitigated. 03 07 2024 10 09 2024 15 09 2024 25 09 2024 Email: chase.mccreary@wsu.edu Email: stevesol@wsu.edu Electronic Cooling Extended Surfaces/Fins Forced Convection Thermal...

... and heat transfer electronic cooling heat transfer enhancement micro/nanoscale heat transfer thermal management systems References [1] Tuckerman , D. B. , and Pease , R. F. W. , 1981 , “ High-Performance Heat Sinking for VLSI ,” IEEE Electron Device Lett. , 2 ( 5 ), pp...

... 07 08 2024 09 08 2024 10 09 2024 Graphical Abstract Figure pool boiling stacking ensemble Random Forest CHF BHTC electronic cooling heat transfer enhancement In heat transfer, pool boiling is extremely efficient for various industrial applications like...

...@cec.sc.edu 09 03 2024 09 06 2024 12 06 2024 12 07 2024 Graphical Abstract Figure heat pipe 3D printing flexible polymer dielectric electronic cooling Heat pipes are highly efficient thermal transfer devices that utilize the two-phase heat and mass...

....com Email: jpshi@njnu.edu.cn Email: 61080@njnu.edu.cn 05 12 2023 08 06 2024 12 06 2024 17 06 2024 Conduction Electronic Cooling Forced Convection Heat and Mass Transfer Porous Media National Natural Science Foundation of China 10.13039/501100001809...

... for Electronics Cooling ,” Renew. Sustain. Energy Rev. , 78 , pp. 821 – 833 . 10.1016/j.rser.2017.04.112 [8] Hoang , C. H. , Rangarajan , S. , Manaserh , Y. , Tradat , M. , Mohsenian , G. , Choobineh , L. , Ortega , A. , Schiffres , S. , and Sammakia , B. , 2021...

... SHERPA algorithm structure optimization electronic cooling energy systems Graphical Abstract Figure 19 12 2023 27 04 2024 27 04 2024 23 05 2024 1 Corresponding author. Email: bingyun.jiang@zju.edu.cn Email: 13793126197@163.com Email: 2114835747...

...: amohanty_me@vssut.ac.in 08 12 2023 05 04 2024 14 04 2024 10 05 2024 Graphical Abstract Figure free convection heat sink design rectangular slots Nusselt number heat transfer neck position conduction electronic cooling extended surfaces/fins heat and mass...

... flow blockage volume-averaged simulations electronic cooling extended surfaces/fins heat exchangers heat transfer enhancement porous media High porosity aluminum foams have been widely studied in a variety of flow configurations, which involves channel flow [ 1 – 3 ], impingement systems...

... bubbles electronic cooling heat transfer enhancement The continuous advancement in the functionality and miniaturization of electronic components facilitates a rapid surge in transistor counts within microprocessors, doubling every 2 years [ 1 ] and posing a challenge to effective thermal...

... a significant role in improving the efficiency and reliability of electronic components. These findings demonstrate the potential of using the nanofluids in thermosyphons to enhance their thermal performance in electronic cooling applications. Email: jobin.jose@vit.ac.in 1 Corresponding author. Email...

... , S. M. , and Nieto de Castro , C. A. , 2017 , “ A Critical Review of Traditional and Emerging Techniques and Fluids for Electronics Cooling ,” Renew. Sustain. Energy Rev. , 78 , pp. 821 – 833 . 10.1016/j.rser.2017.04.112 [21] Ghani , I. A. , Kamaruzaman , N. , and Sidik...

... generation prismatic battery system heat dissipation electronic cooling energy systems heat transfer enhancement natural and mixed convection thermal systems 11 08 2023 26 10 2023 06 11 2023 12 01 2024 1 Authors with equal contribution. 2 Corresponding author...

.... , Gradinger , T. , and Cottet , D. , 2014 , “ Compact Gravity Driven and Capillary-Sized Thermosyphon Loop for Power Electronics Cooling ,” ASME J. Therm. Sci. Eng. Appl. , 6 ( 3 ), p. 031003 . 10.1115/1.4026184 [3] Yan , Z. , Huang , H. , and Pan , Z. , 2023 , “ Bubble...

... , pp. 436 – 449 . 10.1016/j.applthermaleng.2016.11.182 [14] Zhao , J. , Huang , S. , Gong , L. , and Huang , Z. , 2016 , “ Numerical Study and Optimizing on Micro Square Pin-Fin Heat Sink for Electronic Cooling ,” Appl. Therm. Eng. , 93 , pp. 1347 – 1359 . 10.1016...

... 1 Corresponding author. Email: vikas.lakhera@nirmauni.ac.in Email: atindra.sscssn@ddu.ac.in 18 09 2022 29 06 2023 03 07 2023 27 07 2023 miniature flat heat pipe (FHP) effective thermal conductivity working fluid orientation electronic cooling forced...

... is used to predict the dimensions of the heat sink based on the charging times required for the electronic cooling application. The Stefan number for all the power inputs and at all orientations is calculated. Figure 11 shows the variation of charging time values with modified Stefan number at different...

... 2023 15 04 2023 16 04 2023 26 06 2023 aluminum nitride (AlN) HTCC embedded cooling microfluidic microchannel cooler electronic cooling forced convection heat and mass transfer heat transfer enhancement National Natural Science Foundation of China 10.13039...

... thermal management system to cool down the downhole electronic components. downhole electronics vapor compression refrigeration exergy analysis harsh thermal environment thermal management system conduction electronic cooling energy efficiency heat and mass transfer heat transfer...