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Keywords: power electronics
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Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061010.
Paper No: TSEA-21-1236
Published Online: October 13, 2021
... tested for power electronics and battery cooling, with more than 500 W transport capabilities in gravity field. In conclusions, loop heat pipes will provide an energy efficient passive thermal control solution for next-generation low emission automotive, particularly for electric vehicles (EVs), which...
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2013, 5(3): 031004.
Paper No: TSEA-12-1033
Published Online: June 24, 2013
... electronic module via a jet impingement scheme utilizing microfinned surfaces. The authors would like to thank Susan Rogers and Steven Boyd, program managers of the Department of Energy Advanced Power Electronics and Electric Motors Program, for supporting this work. They also wish to thank Maikel...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2011, 3(4): 041005.
Published Online: October 28, 2011
...Ronald Warzoha; Amy S. Fleischer The thermal management of high density power electronics can be extremely challenging due to high power loads paired with small device footprints. When these power electronics are used in systems, which require extremely high reliability, the design of the thermal...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2011, 3(2): 021001.
Published Online: July 13, 2011
...Hemin Hu; Jiahui Zhang; Xiaoze Du; Lijun Yang Liquid-cooled heat sink (cold plate) used for power electronics cooling is numerically studied. Thermal performance and hydraulic resistance are analyzed, with emphasis on geometric construction of cooling channels. Two heat transfer enhancing channel...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2011, 3(1): 011002.
Published Online: March 10, 2011
...Ronald Warzoha; Amy S. Fleischer The thermal management of power electronics presents a significant challenge to thermal engineers due to high power loads coupled with small footprints. Inadequate thermal dissipation of these loads can lead to excessively high equipment temperatures and subsequent...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2010, 2(1): 011008.
Published Online: September 23, 2010
...Stephen A. Solovitz; Thomas E. Conder A grooved surface feature is considered as a potential thermal enhancement for electronics cooling with single-phase flow in minichannels. A power electronics module was initially designed using applied computational fluid dynamics (CFD) using a minichannel...