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Keywords: thermal resistance
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Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2022, 14(10): 101005.
Paper No: TSEA-21-1480
Published Online: April 7, 2022
.... In addition, the increase in the width and the number of cavities leads to gain a significant decrease in heat loss and an increase in thermal resistance. For block B4 improvement, the cavities with the previously characterized insulation have been partially filled. The proposed technique ensure high thermal...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2022, 14(9): 091016.
Paper No: TSEA-21-1672
Published Online: April 6, 2022
... are studied numerically and experimentally. The effects of cooling channel spacing as well as the inlet parameters of kerosene on the maximum temperature and temperature uniformity of the plate are investigated with varied heat fluxes. Besides, the thermal resistance and flow resistance of kerosene cooling...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2022, 14(1): 011013.
Paper No: TSEA-20-1775
Published Online: November 18, 2021
... , “ A Hydrodynamic Theory of Changes in a Boiling Process Under Free Convection ,” Not. Acad. Sci. Dep. Tech. Sci. , 4 , pp. 529 – 536 . The evaporator thermal resistance of the segmented finned structure has been shown in Fig. 4 . It also offers a similar trend, as shown by the plane surface. However...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2021, 13(6): 061023.
Paper No: TSEA-20-1620
Published Online: May 12, 2021
... dissipation of the system performance, a second-order R-C network thermal resistance model of the experimental device was established with the parameters determined. The total thermal resistance of the dissipation system presented an increasing tendency with the increase of the heating power and gradually...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2021, 13(3): 031003.
Paper No: TSEA-20-1302
Published Online: September 17, 2020
... configuration reduces thermal resistance by 16% and enhances average Nusselt number by 9.5% compared to rectangular manifold configuration. However, branched manifold configuration shows higher pressure drop in spite of enhancements in thermal performance and flow distribution uniformity. Overall performance...
Journal Articles
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. August 2019, 11(4): 044501.
Paper No: TSEA-19-1178
Published Online: July 15, 2019
... O 3 nanofluid, which will find application in smaller electronic units. It is found that use of nanofluid decreases the wall temperature distribution of TPCT. Thermal resistance of TPCT decreases whenever TPCT is filled with nanofluid and a maximum of 36.4% reduction in thermal resistance is noted...
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. December 2019, 11(6): 061006.
Paper No: TSEA-18-1653
Published Online: May 3, 2019
... (PCMs) erythritol slug oscillations thermal resistance Thermal management technologies are given a lot of attention with the development of electronic components. More efficient cooling devices need to be developed to remove a high heat flux. Oscillating heat pipes (OHPs) serve as a self...
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. December 2014, 6(4): 041006.
Paper No: TSEA-13-1165
Published Online: May 9, 2014
... pattern are summarized as a flow map showing the heating rate versus the volume ratio. The recovered heat and the thermal resistance of the thermosyphon loop were clearly improved by using the core blocks with narrow holes instead of hollow blocks for the treated volume ratios from 20% to 80%. The thermal...
Journal Articles
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. June 2014, 6(2): 021011.
Paper No: TSEA-12-1115
Published Online: January 24, 2014
... approximately 2.9% with the decrease of porosity from 80% to 70%. Fig. 7 The average heat transfer coefficient of MCHS with foam 60 PPI The cooling performance of a microchannel heat sink partially with copper foam is evaluated by the overall thermal resistance, R th defined as (14) R...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2011, 3(3): 031009.
Published Online: August 12, 2011
... the positives and negatives of advanced solutions. The most commonly used metrics, particularly thermal resistance, are limited in their applicability, especially because they account for only for single factors like the temperature of the heated device. To improve these comparisons, a new volumetric...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021003.
Published Online: November 4, 2009
... ° C cooler than a non-VC based heat-sink with high power density. The junction-to-case thermal resistance of the power module based on the VC is about 50% less than that of the power module based on a copper substrate with the same weight. The chip overshooting temperature of the copper substrate...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2009, 1(2): 021002.
Published Online: August 20, 2009
... dimensionless parameters: the conductive thermal resistance ratio and the porosity. After validation of the method by comparison of our results with those from both the literature studies and the numerical simulation, a parametric study is carried out to show the influence of the dimensionless parameters...