Pressure and shear flow factors (Patir and Cheng, 1978) were used to take into account the roughness of the pad surface in the modeling of the interfacial fluid pressure during chemical mechanical polishing. An attempt was made to explain the physical meaning of the flow factors in this particular application. Additionally, a parametric study was carried out to see the effect on the model after the incorporation of the flow factors. The pressure and shear flow factors were found to have a competing effect on the magnitude of the sub-ambient fluid pressure.
1.
Shan, L., Levert, J. L., and Danyluk, S., 1998, “Pressure Distribution at the Silicon/Polishing Pad Interface,” Proceedings of ASPE Spring Topical Meeting on Silicon Machining, pp. 96–100.
2.
Patir
, N.
, and Cheng
, H. S.
, 1978
, “An Average Flow Model for Determining Effects of Three-Dimensional Roughness on Partial Hydrodynamic Lubrication
,” ASME J. Lubr. Technol.
, 100
, pp. 12
–17
.3.
Patir
, N.
, and Cheng
, H. S.
, 1979
, “Application of Average Flow Model to Lubrication between Rough Sliding Surfaces
,” ASME J. Lubr. Technol.
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–17
.4.
Shan
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, J. L.
, Meade
, L.
, Tichy
, J. A.
, and Danyluk
, S.
, 2000
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,” ASME J. Tribol.
, 122
(3
), pp. 539
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.5.
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6.
Harp
, S. R.
, and Salant
, R. F.
, 2001
, “An Average Flow Model of Rough Surface Lubrication with Inter-Asperity Cavitation
,” ASME J. Tribol.
, 123
(1
), pp. 134
–143
.7.
Ng
, S. H.
, Hight
, R.
, Zhou
, C.
, Yoon
, I.
, and Danyluk
, S.
, 2003
, “Pad Soaking Effect on Interfacial Fluid Pressure Measurements During CMP
,” ASME J. Tribol.
, 125
(3
), pp. 582
–586
.8.
Peklenik
, J.
, 1967
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, J. B. P.
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Munson, B. R., Young, D. F., and Okiishi, T. H., 1990, Fundamental of Fluid Mechanics, John Wiley & Sons, Canada.
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