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Keywords: lead bonding
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Journal Articles
Journal:
Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. July 2003, 125(3): 576–581.
Published Online: June 19, 2003
... features superior to soldering and other solderless methods. Therefore, thermosonic ball bonding is used for the majority of interconnections to integrated circuits. ultrasonic bonding lead bonding interface phenomena mechanical strength mechanical contact rough surfaces friction integrated...
