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Keywords: vacuum microelectronics
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Journal Articles
Journal:
Journal of Tribology
Publisher: ASME
Article Type: Technical Papers
J. Tribol. October 2001, 123(4): 725–731.
Published Online: December 6, 2000
...; revised manuscript received December 6, 2000. Associate Editor: C.-P. R. Ku. 06 June 2000 06 December 2000 vacuum microelectronics interconnected systems ultrasonic bonding integrated circuit packaging mechanical contact The wire bonding process is an important step...
